Senior Researcher I - Advanced Packaging Simulation and Modelling

Senior Researcher I - Advanced Packaging Simulation and Modelling
Tyndall National Institute
Cork, Ireland
€ 61,471 - € 73,392 per year
Role Description
The Photonics Packaging and Systems Integration Group at Tyndall National Institute invites applications for the position of Senior Researcher I – Advanced Packaging Simulation and Modelling.
This role will contribute to the development of advanced packaging technologies for next-generation photonic and electronic systems, with a particular focus on simulation and modelling activities supporting the development of scalable packaging solutions and pilot line activities within PIXEurope. The successful candidate will develop and apply modelling methodologies to support the design, optimisation and experimental validation of packaging technologies, components and integrated systems.
A key objective of the role will be to develop broader multiphysics modelling capabilities within the group, building from electrical and electromagnetic modelling towards the integration of thermal, mechanical and optical considerations where appropriate. The role will also develop cost and techno-economic modelling approaches to support the assessment of packaging processes, manufacturing scalability and technology trade-offs.
The successful candidate will work closely with researchers and engineers across the group to identify modelling requirements, correlate models with experimental results and develop modelling methodologies that can be applied across research, pilot line and technology development activities. The role will contribute to PIXEurope and other strategic research programmes, support the development of research proposals and help establish a broader simulation and modelling capability within the group.

Key Responsibilities

Reporting to the Head of the Photonics Packaging and Systems Integration Group, the Senior Researcher will:
Develop and apply simulation and modelling approaches for advanced photonic and electronic packaging technologies, with particular emphasis on electrical and electromagnetic modelling.
Develop multiphysics modelling approaches incorporating electrical, electromagnetic, thermal, mechanical and optical effects as appropriate to the application.
Support the design and optimisation of packaging technologies, components and integrated systems through modelling, simulation and experimental validation.
Develop cost and techno-economic modelling approaches to assess packaging processes, manufacturing scalability and technology trade-offs.
Work closely with researchers and engineers to identify modelling requirements, correlate simulation with experimental results and integrate modelling into technology and process development activities.
Develop reusable modelling methodologies and workflows that can support research projects, PIXEurope pilot line activities and future packaging technologies.
Lead technical work packages and joint research activities, coordinating with researchers, engineers and project partners to ensure delivery of project objectives, milestones and technical outputs.
Contribute to the development of research proposals, funding applications and new research opportunities, including assisting with the formation of academic and industry partnerships.
Support the development of the group's simulation and modelling capability, including mentoring postgraduate students, researchers and early-career staff where appropriate.
Ensure compliance with Tyndall's Quality Management System, Health and Safety standards and other relevant regulations.
To carry out any additional duties, such as general group activities, administrative tasks or Education and Public Engagement activities, that may reasonably be required within the general scope and level of the post.
Essential Criteria
PhD qualification in Electrical Engineering, Electronic Engineering, Physics, Photonics or a closely related discipline.
Typically, 6 years' academic or relevant industrial R&D experience.
Strong experience in the design, simulation and modelling of electronic devices, components, subsystems or integrated systems.
Strong experience in electrical and/or electromagnetic modelling and simulation.
Experience using commercial or research simulation tools for electromagnetic, electrical, thermal or multiphysics modelling.
Experience combining modelling and simulation with experimental characterisation or validation.
Experience contributing to research proposals, funding applications or the development of new research opportunities.
Demonstrated ability to lead technical research activities and work widely with researchers, engineers and academic or industrial partners.
Strong communication and technical report-writing skills, including experience presenting and/or publishing technical or research results.
Desirable Criteria
Experience in advanced electronic or photonic packaging technologies, including 2.5D or 3D integration approaches.
Experience with multiphysics modelling, including coupled electrical, electromagnetic, thermal, mechanical or optical simulation.
Experience developing models or simulation methodologies to support packaging process development, optimisation or manufacturing.
Experience in cost modelling, techno-economic analysis, manufacturing cost assessment or related approaches.
Experience with RF, microwave or high-frequency electronic systems and their packaging and integration.
Experience participating in national, European or industrially funded research programmes and contributing to research proposals.
Experience of international contributions, such as invited presentations, conference organisation or postgraduate examination.
Experience supervising students or mentoring early-career researchers.
Apply Now
Don't forget to mention EuroScienceJobs when applying.
Share this Job
More Job Searches
Ireland
Electrical Engineering
Engineering
Government/Public Sector
Hybrid
PhD Required
Physics
Tyndall National Institute