Senior Engineer II - Photonic Packaging and Process Development

Senior Engineer II - Photonic Packaging and Process Development
Tyndall National Institute
Cork, Ireland
€ 72,044 - € 91,259 per year
About the Role
The Photonics Packaging and Systems Integration Group at Tyndall National Institute invites applications for the position of Senior Engineer II – Photonic Packaging and Process Development. This role focuses on the development of advanced photonic packaging technologies, processes, and integration methodologies for next-generation photonic and electronic systems. The successful candidate will contribute to the development and optimisation of packaging solutions that support high-performance photonic devices and can be transferred to scalable manufacturing environments, including pilot line activities such as PIXEurope.
A key aspect of the role will be the development of advanced packaging processes for emerging photonic applications, including low-loss cryogenic packaging technologies and advanced micro-optic integration approaches. The role will leverage Tyndall's advanced packaging, assembly, and characterisation facilities to develop innovative solutions that address challenges in quantum technologies, communications, sensing, and other advanced photonic applications.
The successful candidate will provide technical leadership in photonic packaging and process development activities, support the delivery of strategic programmes such as P4Q, lead technical projects, contribute to major funding proposals, develop collaborations with academic and industrial partners, and support the growth and development of engineers and researchers within the group.
Key Duties & Responsibilities
Reporting to the Head of the Photonics Packaging and Systems Integration Group, the Senior Engineer II will:
Provide technical leadership in photonic packaging, process development, and advanced photonic integration technologies.
Manage the development of low-loss cryogenic packaging solutions and advanced micro-optic integration technologies, including 3D printed micro-optics for photonic devices.
Lead and manage technical projects, ensuring delivery of project objectives, milestones, and high-quality outcomes.
Develop new packaging processes and capabilities with a focus on automation, scalability, manufacturability, and industrial deployment.
Play a significant role in the development of large-scale proposals, including proposal writing, consortium development, work package planning, technical leadership, partner coordination, and defining project activities and deliverables.
Build collaborations with academic, industrial, and research partners that support future funding opportunities, research activities, and commercial engagement.
Support and mentor engineers, researchers, and students, contributing to the development of technical expertise within the group.
Ensure all activities support and are compliant with the Tyndall Quality Management system.
Ensure all activities support and are compliant with the required Health and Safety standards.
Carry out any additional duties as may reasonably be required within the general scope and level of the post.
Essential Criteria
Master’s Degree qualified with typically eight years academic and/or industrial experience.
Strong technical expertise in photonic packaging technologies, including optical assembly, active alignment, photonic device integration, packaging process development, and advanced packaging platforms.
Experience in cryogenic photonic packaging and advanced micro-optic integration technologies, including 3D printed micro-optics for photonic devices.
Experience managing technical projects and leading activities across multidisciplinary teams.
Evidence of developing technical capabilities and contributing to the growth of a research or engineering group, including mentoring junior staff.
Demonstrated significant contribution to the development of large-scale proposals, including activities such as proposal writing, consortium development, work package planning, technical leadership, partner coordination, and defining project activities and deliverables.
Experience in building research or industry collaborations that have the potential to generate future funding opportunities, research activities, or commercial engagement.
Evidence of establishing an external profile through invited talks, conference presentations, technical training activities, or participation in international collaborations.
Proven ability to manage and support project teams, with excellent communication skills and the ability to work effectively across multidisciplinary research, engineering and industry teams.
An appetite for professional growth, with the potential and ambition to take on increasing technical, strategic and leadership responsibility as the team develops.
Desirable Criteria
Experience developing alignment and packaging routines using advanced photonic packaging platforms such as ficonTEC FL300 and/or CL1500 systems.
Experience in optical packaging processes for fibre array attachment to silicon photonics and InP-based photonic integrated circuits.
Knowledge of microoptics design is considered an advantage.
Experience characterising photonic and optoelectronic devices, including optical calibration, warpage measurements, fibre coupling, laser alignment, and performance evaluation.
Experience supporting the transfer of advanced packaging technologies towards manufacturing environments and pilot line activities.
Experience mentoring, coaching or providing technical leadership to engineering, students and project teams.
Apply Now
2 days left
Don't forget to mention EuroScienceJobs when applying.
Share this Job
More Job Searches
Ireland
Engineering
Government/Public Sector
Hybrid
Physics
Solid State Physics
Tyndall National Institute